Blog
Practical guidance on PCB fabrication, DFM, stackups, surface finishes, and assembly models—written for engineers and buyers preparing RFQs.
How to Choose PCB Materials: FR-4, Rogers, Polyimide, Metal Core
A material selection guide for rigid FR-4, high-Tg and low-loss laminates, flex polyimide, Rogers/PTFE, and metal core—matched to thermal, mechanical, and SI requirements.
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PCB Manufacturing ID: PCB-0001 5 min read
How to Choose PCB Materials: FR-4, Rogers, Polyimide, Metal Core
A material selection guide for rigid FR-4, high-Tg and low-loss laminates, flex polyimide, Rogers/PTFE, and metal core—matched to thermal, mechanical, and SI requirements.
Read article -
PCB Assembly ID: PCB-0002 5 min read
BGA Assembly and X-Ray Inspection Explained
Why area-array packages need paste and pad design review, when AOI is not enough, and how X-ray inspection fits prototype and production PCBA gates.
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PCB Design Guide ID: PCB-0003 5 min read
DFM Checklist Before PCB Production Release
A practical pre-production checklist covering fabrication, assembly, test access, and documentation—so your release package survives engineering review without a respin.
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PCB Assembly ID: PCB-0004 5 min read
SMT vs Through-Hole Assembly: Process and Cost Differences
When surface-mount wins, when through-hole still matters, and how mixed-technology boards sequence SMT, wave, and selective solder without yield surprises.
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PCB Design Guide ID: PCB-0005 7 min read
PCB Stackup Planning for Controlled Impedance
How to build a stackup table that fabricators can quote and your SI team can measure: reference planes, dielectric targets, differential pairs, coupons, and tolerance choices.
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PCB Assembly ID: PCB-0006 6 min read
Turnkey vs Consignment PCB Assembly: Which Model Fits Your Project
Who buys the components changes everything: cost visibility, lead time, risk ownership, and how much engineering time you spend. A practical guide to choosing between turnkey, consignment, and hybrid assembly.
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PCB Design Guide ID: PCB-0007 6 min read
Rigid-Flex PCB Design Guide: Bend Radius, Stiffeners, and Coverlay
The mechanical decisions that make or break rigid-flex designs: bend radius rules, static vs dynamic flexing, stiffener strategy, coverlay openings, and stackup choices.
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PCB Manufacturing ID: PCB-0008 6 min read
PCB Surface Finish Comparison: HASL vs ENIG vs OSP vs Immersion Silver
A practical comparison of the four most common PCB surface finishes—solderability, flatness, shelf life, cost, and the failure modes each one brings.
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PCB Design Guide ID: PCB-0009 6 min read
HDI PCB Design Guide: Microvias, Stackups, and Cost Drivers
How microvia structures, sequential lamination, and via-in-pad decisions drive HDI cost and reliability—and how to choose the simplest stackup that routes your design.
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PCB Design Guide ID: PCB-0010 6 min read
What to Expect from a DFM Review on Your PCB Stackup
What a real PCB DFM review covers—annular rings, mask slivers, copper balance, finish trade-offs, HDI and flex risks, and test access—and how to answer questions without slowing your quote.
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PCB Manufacturing ID: PCB-0011 6 min read
Preparing Gerber Files for Smooth PCB Manufacturing
A practical Gerber and fabrication-data checklist: layer naming, drill parity, apertures, stackup notes, impedance tables, and panelization decisions that cut RFQ back-and-forth before tooling.
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Technical Briefings
Occasional deep-dives into PCB manufacturing trends, engineering best practices, and material innovations from our lead engineers.