Case studies
Representative programs—anonymized and written for engineers and buyers. They show how DFM review, stackup choices, and clear RFQ ownership change outcomes. Customer names and confidential metrics are omitted by design.
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Industrial electronics
Industrial multilayer controller: fab + mixed-technology assembly
6-layer rigid FR-4 · SMT + through-hole
A controls OEM needed a reliable path from revised Gerbers to assembled controllers—without juggling separate fab and assembly vendors mid-spin.
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Communication equipment
Compact HDI module: microvia stackup without over-building
HDI 1+N+1 · via-in-pad · controlled impedance
A module team specified a 2+N+2 HDI stackup for a fine-pitch BGA. Engineering review showed a simpler 1+N+1 with staggered microvias could route the escapes.
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Medical devices
Portable instrument: rigid-flex replacing a cable harness
Rigid-flex · static bend · polyimide coverlay
A portable instrument team needed to remove a failure-prone cable interconnect between a display subassembly and the main controller.
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IoT hardware
Turnkey IoT gateway: sourcing + fab + assembly under one program
4-layer rigid · full turnkey PCBA
A startup needed finished gateway boards for a pilot customer without standing up a full purchasing team for a 120-line BOM.
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Sample builds
Boards we’ve built
Representative bare boards and assembled PCBAs across rigid multilayer, mixed-technology, and power designs. Customer-identifying details are omitted by design.
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Multilayer bare board
Rigid FR-4 · multilayer
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Main control board
SMT + through-hole
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Industrial control board
Multilayer · SMT
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Embedded controller
Fine-pitch SMT · module
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USB power module
Mixed technology
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Have a program that looks like one of these?
Send Gerber, BOM, and mechanical notes. We will review stackup, assembly, and inspection scope the same way—before you commit to a build.