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Custom PCB Fabrication Services

From quick-turn prototypes to controlled production builds, MOZPCB fabricates rigid, multilayer, HDI, and specialty boards with transparent engineering support—so your quote reflects what will actually be built.

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Multilayer bare PCB with dense routing
Multilayer bare board · rigid FR-4

Service overview

PCB fabrication is where design intent meets process capability. Layer count, copper weight, dielectric choice, surface finish, and mechanical outline all interact; a drawing that looks complete can still leave critical decisions open. MOZPCB treats every fabrication RFQ as an engineering intake—not a price-only transaction—so stackup, impedance, and manufacturability are aligned before panels enter production.

Our fabrication scope covers the board types hardware teams use most often: rigid FR-4 for general electronics, advanced multilayer for dense digital and mixed-signal designs, HDI with microvias when escape routing demands it, metal core for LED and power thermal paths, and RF-oriented laminates when controlled dielectric performance is part of the product requirement. Specialty constructions are reviewed case by case against material availability and process windows.

What separates a reliable fab partner from a catalog price sheet is how early problems surface. We flag annular-ring risk, copper imbalance, mask-defined pad conflicts, drill-to-copper clearance issues, and impedance coupon needs during review—so you get a firm path to tooling instead of surprises after the first article. Whether you are spinning an EVT board or releasing a locked pilot lot, the same documentation backbone carries forward.

If your program also needs assembly or turnkey sourcing, fabrication stays coordinated with the PCBA traveler: finish selection, panelization, and test coupon strategy are chosen with downstream reflow and inspection in mind, not in isolation.

What we offer

  • Rigid and multilayer PCBs for consumer, industrial, and communications products
  • Prototype and small-batch runs with documented process controls and revision traceability
  • HDI and fine-feature builds where density, registration, and microvia architecture drive the design
  • Metal core and thermally conscious layouts for power conversion and LED modules
  • High-frequency and hybrid material options when your stackup targets controlled dielectric performance
  • Surface finishes including HASL, lead-free HASL, ENIG, OSP, and immersion silver
  • Controlled impedance builds with stackup tables, tolerance targets, and coupon planning
  • DFM feedback on spacing, annular rings, mask-defined pads, copper balance, and testability
  • Mechanical options: V-score, tab routing, countersinks, and array formats for assembly partners
  • Incoming and in-process inspection aligned to your acceptance criteria and IPC class expectations

Technical capabilities

  • Board types: rigid, flex, rigid-flex, HDI, metal core (project-dependent)
  • Layer counts from 1–2 layer quick turns through multilayer builds up to 32 layers for supported constructions
  • Copper weights including 1 oz, 2 oz, 3 oz, and heavier where etch and plating allow
  • Dielectrics from standard and high-Tg FR-4 to Rogers/PTFE hybrids when the RFQ specifies them
  • Minimum line/space and via structures confirmed per copper weight and imaging capability
  • Stackup assistance for controlled impedance, differential pairs, and hybrid material builds
  • Solder mask and silkscreen in common colors; legend clarity reviewed against fine-pitch fields
  • Electrical test: flying probe or fixture-based continuity/isolation per job agreement
  • Mechanical routing, scoring, and panelization suited to SMT carriers and depanelization plans

Common applications

  • Industrial control, automation, and ruggedized embedded hardware
  • IoT gateways, sensors, edge devices, and connected product mainboards
  • Power conversion, motor drives, battery management, and LED lighting modules
  • Telecom infrastructure, enterprise networking, and RF-adjacent digital boards
  • Medical and diagnostic electronics requiring disciplined documentation and lot control
  • Automotive-adjacent and mobility electronics where thermal and vibration margins matter

How the process works

  1. 01

    File and stackup intake

    Share Gerber/drill data, layer map, impedance tables, mechanical drawings, and any IPC class or finish constraints. Incomplete packages are clarified before quoting—not after.

  2. 02

    Engineering and DFM review

    We check annular rings, clearances, copper balance, finish suitability, and coupon needs, then align on open questions that would otherwise delay tooling.

  3. 03

    Fabrication and in-process checks

    Boards are built to the agreed traveler with imaging, plating, lamination, and drill/rout controls appropriate to the construction.

  4. 04

    Test, packing, and handoff

    Electrical test and visual inspection per agreement, then protective packing and labeling ready for assembly, inventory, or shipment.

Inside PCB fabrication

  • PCB copper plating line
    Plating line
  • Panelized PCBs after fabrication
    Panelized boards
  • Laminate and core material storage
    Laminate store

Related services

PCB Assembly Services Turnkey PCB Assembly Services View PCB capabilities Request a quote

FAQ

What files do you need for a fabrication quote?
Gerber and drill data are the baseline. A clear layer map, stackup notes, impedance tables, mechanical drawings, surface-finish callouts, and quantity/lead-time targets help us respond faster and avoid rework. If impedance or HDI structures are involved, include those notes in the first RFQ—not after review cycles.
Do you support prototype quantities as well as small-batch production?
Yes. We regularly support engineering prototypes, EVT/DVT lots, and small-batch production with the same technical rigor. Prototype programs emphasize fast feedback and DFM learning; production releases lock the traveler and change control.
Which surface finish should I choose for my PCB?
ENIG is common for fine-pitch SMT and longer shelf life; HASL/lead-free HASL is cost-effective when topography allows; OSP suits short-cycle SMT programs; immersion silver is used when planarity and cost need a middle path. Finish choice should match pitch, storage time, and reflow count—flag those in the RFQ and we will confirm during review.
Can you build controlled-impedance multilayer boards?
Yes. Provide target impedances, tolerances, reference layers, and any differential-pair constraints. We align stackup and coupon strategy before tooling so the quote reflects a measurable construction rather than an assumed dielectric set.
How do you handle HDI, metal core, or high-frequency materials?
Those constructions are in scope when the design requires them. HDI quotes include via-architecture review; metal-core quotes start from thermal budget and dielectric grade; high-frequency builds need laminate callouts and RF stackup notes. Share the specialty requirement up front so lead time and cost are realistic.
What inspection and electrical test options are available?
Flying-probe or fixture-based electrical test, AOI-related process controls where applicable, and visual inspection against agreed criteria are typical. Higher IPC class expectations, cross-sections, or special reports can be added when the end market requires them—state the acceptance standard in the RFQ.

Get started

Ready for the next step?

Send your project files and requirements. We will review stackup, assembly, and test needs, then respond with a clear quotation path.

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